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DuPont Microcircuit and Component Materials Demonstrates Value of GreenTape™ LTCC in AiP Applications
SAN DIEGO, CA, May 4, 2022 - DuPont (NYSE:DD) Microcircuit and Component Materials (MCM) is collaborating with Industrial Technology Research Institute (ITRI) of Taiwan to demonstrate the value of DuPont™ GreenTape™ LTCC (Low Temperature Co-fired Ceramics) material used in AiP (Antenna in Package) applications. This collaboration is resulting in an ideal alternative to existing Print Circuit Board (PCB) options.
Chinaplas 2021: ENGEL at Industry 4.0 – Factory of the Future
How can consistently high product quality be maintained in the face of fluctua-tions in raw material? How can high machine availability and productivity be ensured even in the face of travel restrictions?